Difference between revisions of "Hardware/NAND"

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(samsung links)
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  Hynix: ad 76 / ad f1 / ad dc  (64MB = [http://www.hynix.com/datasheet/pdf/flash/HY27US(08_16)12(1_2)B%20Series(Rev0.5).pdf HY27US0812(1/2)B], 128MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF(08_16)1G2A%20Series(Rev0.4).pdf HY27UF081G2A], 512MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF084G2M%20Series(Rev.0.7).pdf HY27UF084G2M])
 
  Hynix: ad 76 / ad f1 / ad dc  (64MB = [http://www.hynix.com/datasheet/pdf/flash/HY27US(08_16)12(1_2)B%20Series(Rev0.5).pdf HY27US0812(1/2)B], 128MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF(08_16)1G2A%20Series(Rev0.4).pdf HY27UF081G2A], 512MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF084G2M%20Series(Rev.0.7).pdf HY27UF084G2M])
  Samsung: ec 76 / ec f1 / ec da / ec dc (64/128/256/512)
+
  Samsung: ec 76 / ec f1 / ec da / ec dc (64M [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=158&partnum=K9F1208U0C K9F1208U0C] /128 [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=159&partnum=K9F1G08U0B K9F1G08U0B]/256 [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=159&partnum=K9F2G08U0A K9F2G08U0A]/512 = [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=159&partnum=K9F4G08U0A K9F4G08U0A])
 
  Toshiba: 98 76 / 98 f1 / 98 da (64/128/512)
 
  Toshiba: 98 76 / 98 f1 / 98 da (64/128/512)

Revision as of 14:54, 12 April 2008

The Wii contains 512MiBi of NAND flash storage, which is used to store "system software", channels (including Virtual Console titles), game saves, and system settings.

The NAND flash device is divided into 2048-byte blocks.

  • Blocks 0-0x3F: boot1
    • boot1 is the second-stage bootloader; it is decrypted by boot0, which resides on a mask rom inside the Starlet coprocessor. Its primary function is to load and decrypt boot2.
  • Blocks 0x40 - 0x89: boot2 (first copy)
  • Blocks 0x1C0 - ? : boot2 (second copy)
    • boot2 is the third-stage bootloader; it is stored in a modified WAD format, including a ticket that is encrypted with the common key and signed.


The NAND flash driver inside boot2 and IOS supports the following chip IDs:

Hynix: ad 76 / ad f1 / ad dc  (64MB = HY27US0812(1/2)B, 128MB = HY27UF081G2A, 512MB = HY27UF084G2M)
Samsung: ec 76 / ec f1 / ec da / ec dc (64M K9F1208U0C /128 K9F1G08U0B/256 K9F2G08U0A/512 = K9F4G08U0A)
Toshiba: 98 76 / 98 f1 / 98 da (64/128/512)