Hollywood

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The security chip in the Wii is known as Hollywood; it bears the logos of NEC (who presumably manufactured the chip), ATI (who designed the GPU inside), and BroadOn (who designed the Starlet "I/O Bridge").

Its hardware is documented on the Hardware article and subpages. Hardware inside includes the GX, boot0 ROM, OTP, and Starlet

Hollywood article at Wikipedia

Pinout (Hollywood, Hollywood AA)

The Hollywood chip is 2 or 3 flip-chip dies bonded to a BGA substrate, with a 30 x 30 (or later, 28x28) grid of balls to connect it to the rest of the circuit. Most balls are connected to other layers by way of vias; some signals are routed completely on the top layer.

(Please help verify and complete this pinout with a continuity tester! This pinout is for the earlier 30x30 version of the Hollywood; the 28x28 package has a completely different pinout.)

Pins grouped by function

Function Balls
Ground A1, A15, A17, A30, B4, B16, B17, B18, B29, C17, C18, C19, C24, C25, C27, C29, D4, D25, D26, D27
NAND Flash C1, C2, D1, D2, D3, E1, E2, E3, E4, F1, F2, F3, F4, F5, G4, G5, H4, J1
GDDR3 R2, R3, T1, U1, U2, V2, W1, X1, Y3, Y4, AA2, AA3, AA4, AA5, AB2, AB3, AB4
USB A26, A27, A28, B26, B27, B28
AVE D28, E28, G28, H28, H29, J27, J28, J29, J30

Pinout (Hollywood-1, Hollywood-2)